FIELD: radio instrumentation engineering. SUBSTANCE: in manufacturing printed-circuit boards incorporating components that function to open/close electric circuits and are placed at any point of their pattern, copper electroplating is followed by electric deposition of wear-resistant nickel-boron alloy onto entire pattern of circuit, pattern components meant to open/close the circuit are shielded, and remaining part of circuit pattern is covered with tin-lead metal resist; upon etching circuit pattern, tin-lead alloy is subjected to infrared fusion. EFFECT: facilitated procedure.
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