FIELD: radio engineering. SUBSTANCE: process of manufacture involves mechanical working of plates from unfoiled glass cloth-based laminate, chemical treatment (etching and modification) in acidic solutions containing chromium oxide (YI), vacuum sputtering of adhesive sublayer of metal from group of chromium, nickel or vanadium, application of conductive copper layer and formation of pattern of circuit in conductive and adhesive layers. EFFECT: increased productivity and quality of printed circuit boards. 1 tbl
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