FIELD: technological processes.
SUBSTANCE: invention may be used for removal of solidified silicon compositions from parts that do not allow for mechanical methods of removal. Method consists in application of dissolvent that includes mixture of xylene and acetone with ratio of 1:1, maintenance for 0.5-1 minutes, and if necessary, mixture application is repeated until silicon composition completely peels.
EFFECT: invention provides removal of compositions without damage of varnish or conversion coats.
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