FIELD: technological processes; metallurgy.
SUBSTANCE: method includes cutting of defect point, scraping of component surface from heat resistant coat and component soldering in vacuum. Scraping is realised in local section of surface that adjoins defect point. Afterwards defect point is filled with solder and soldered. Besides in order to provide make-up of solder melt to defect point in time of soldering under vacuum, solder layer is applied on scraped local section of component surface. At that height of applied layer is selected higher than the level of defect point filling with solder. Surface scraping is done around defect point in scraping strip with width of 5-6 mm. Solder used is composite solder "ВПр11-40Н". Height of applied solder layer is selected as more than level of defect point filling with solder by 3-5 mm.
EFFECT: pore-free high-quality adhesion of solder to component, increase of its service life.
4 cl, 4 dwg
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