FIELD: heating.
SUBSTANCE: invention relates to electronic items cooling. The cooling method of electronic items includes active cooling with the use of heat-removing cooling element 1, temperature gradient creation in the thermal pipe and heat removal from the hot side of heat-removing cooling element 2. The thermal collector may cool the items. Method of cooling simulation includes simulation of cooling and heat removal from the cooled items or components using heat-removing cooling element 1 and simulation of heat removal from the hot side of the second heat-removing cooling element. The cooled element is installed into the housing under pressure. The cooling device contains heat-removing cooling element 1 having thermal communication with the cooled item, thermal tube, heat-removing cooling element 2 and primary heat sink element. There is an evaporable liquid in the thermal tube.
EFFECT: improvement of electronic borehole items cooling control.
25 cl, 5 dwg
