FIELD: chemistry.
SUBSTANCE: method involves cathodic deposition thus making tantalum plating at DC current density 50 A/dm2 at simultaneous pulse current effect of amplitude 0.05 to 5 A, frequency 10 Hz to 10 kHz, pulse duration 10-5 to 10-2 s from aquosystem of metal tantalum content 10-50 g/l and ammonium hydrofluoride 100-300 g/l at temperature +18° to +40°C. The second method involves cathodic deposition thus making tantalum plating at DC current density 50 A/dm2 at simultaneous pulse current effect of amplitude 0.05 to 5 And, frequency 10 Hz to 10 kHz, pulse duration 10-5 to 10-2 s from the aquosystem prepared by dissolving metal tantalum in aqueous solution, containing ammonium hydrofluoride 100-300 g/l, in activating alternating current of frequency 50 Hz until tantalum concentration in electrolyte is 10-50 g/l.
EFFECT: producing high-quality tantalum plating from aquosystem.
2 cl, 1 ex
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Authors
Dates
2009-04-20—Published
2007-02-16—Filed