CHIPBOARD Russian patent published in 2009 - IPC B27N3/02 

Abstract RU 2355569 C2

FIELD: wood industry.

SUBSTANCE: invention pertains to production of chipboards. The board includes bottom and top surface layers with fine particles, and an intermediate layer with more coarse particles is placed between these surface layers. The intermediate layer has various density in the areas, where the board is supposed to be attached to an other object. The chipboard production method includes even distribution of fines followed by generation of the first particle matrix to form a bottom surface layer, distribution of more coarse particles followed by generation of the second particle matrix above the fine particle matrix using a distribution device so that at least in one zone the coarse particles are applied in a more thick layer than at least in one surrounding area, even distribution of the fine particles followed by generation of the third coarse particle matrix to form a top surface layer and compression of the first, second and third matrices, whereby the intermediate layer thickness remains virtually unchanged, so the intermediate layer has various density.

EFFECT: produced chipboards feature increased soundproof and heat-insulating properties, and light weight, that facilitates efficient shipment of the processed boards.

9 cl, 13 dwg

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RU 2 355 569 C2

Authors

Nil'Sson Bu

Dates

2009-05-20Published

2004-11-12Filed