FIELD: electronics.
SUBSTANCE: invention relates to devices dealing with heat removal from electronic components. The technical result is achieved by the radiator (1) containing a multiple number of radiator plates (2) with two parallel edges (3), (4). Close to edges (3), (4) the plates (2) are fastened together via heat-conducting gaskets (5). As a result, heat-absorbing part (6) and head-dissipating parts (7) are formed. The heat-absorbing part contacts with heat-generating surface of electronic component, while the heat-dissipating part is opposite to heat-absorbing part (6).
EFFECT: development of a radiator for electronic component where part of radiator plate surface opposite to heat-absorbing part could be used more effectively while preserving possibility of heat collection from similar elements with different heat removal output.
11 cl, 8 dwg
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