TEMPERATURE CONTROL DEVICE FOR ELECTRONIC COMPONENTS Russian patent published in 2014 - IPC G12B15/00 G05D23/00 H05K7/20 H01L23/34 

FIELD: electricity.

SUBSTANCE: invention is related to electrotechnical equipment intended to ensure performance of integrated circuits (IC) in the protected on-board equipment, in particular, in microprocessors and microcontrollers, by thermal stabilization of IC package surface. In the temperature control device for electronic components comprising a board (e.g., a printed circuit board) intended for layout of radio components, a temperature control circuit and electrically connected heating element and temperature sensor mounted at the board working area, at printed circuit board there is at least one integrated circuit, which demand thermal stabilization and mounted with its connector front, a flat radiator is mounted at its opposite side and a heating element is installed at a pad made in the central radiator part at its external surface, at that outputs of the heating element are connected to the temperature control circuit through contact pads of the printed circuit board. At that square area of the radiator surface joining the external surface of the integrated circuit package is not less than the square area of the integrated circuit surface.

EFFECT: improving operational efficiency of the device, increasing reliability of the equipment functioning within the whole range of its operating temperature and increasing stability of the device performance.

11 cl, 5 dwg