FIELD: technological processes.
SUBSTANCE: invention is related to the field of abrasive processing and may be used in production of abrasive diamond tool on metallic bond. Diamond particles and composite solder are applied onto substrate surface. The latter comprises low-melting matrix, high-melting filler and binder. Substrate is heated with applied diamond particles and composite solder higher than melt temperature of low-melting matrix, and is maintained at this temperature. Then it is annealed in vacuum or in protective atmosphere at the temperature of low-melting matrix components evaporation.
EFFECT: production of diamond-containing binder with multi-phase structure of pseudo-alloy, which provides for high wear resistance of binder, strength of diamond particles retention and heat conductivity.
10 cl, 1 ex
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Authors
Dates
2009-07-27—Published
2007-12-24—Filed