FIELD: space engineering.
SUBSTANCE: invention relates to spacecraft designs, particularly to artificial satellites. Modular structure comprises bearing structure representing horizontal package consisting of vertical packs of unified crates (1, 1a, 1b, 2, 3). Crates (1, 1a, 1b) of one type are intended for VME or PCI form-factor. Crates of the other type (2, 3) serve to accommodate optional instruments and units, for example storage batteries. Crate height can be subject to quantity of identical-thickness electronic modules located along crate height, and to module form-factor spacing in height. Crate wall thickness ensures required thickness of spacecraft in transfer of loads from carrier, as well as radiation protection of electronic modules. Crates are jointed together with the help of brackets that support elements (12) incorporated with the system intended for separation from carrier. At least one crate of vertical package (1a, 1b) can be arranged via thermal insulating gaskets with their total thickness being multiple to aforesaid form-factor spacing in height.
EFFECT: reduced weight and costs, modular design.
3 cl, 7 dwg
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Authors
Dates
2009-11-27—Published
2007-03-01—Filed