FIELD: technological processes.
SUBSTANCE: invention is related to method and device for automatic control of laser cutting or hole drilling process. Method includes measurement of radiation reflected from zone of processing. Minimum value of reflected radiation amplitude is defined, compared to specified amplitude, and control of laser radiation capacity and/or cutting speed are controlled. Device comprises laser with power supply unit, rotary mirror, focusing lens, 2-coordinate table for fixation of processed part, unit of 2-coordinate table control, photodetector of secondary radiation and transformer of secondary radiation signal from photodetector, connected to unit of laser power supply and unit of 2-coordinate table control.
EFFECT: improved quality and capacity of through laser processing of materials.
2 cl, 1 dwg
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