FIELD: electrical engineering.
SUBSTANCE: invention relates to electrical engineering, particularly, to heating element (6) arranged on metal substrate (1). The said heating element comprises, including said substrate (1), at least one dielectric layer (2) containing resin and dielectric fillers, at least one resistive layer (3) containing resin and conducting fillers, at least one conducting layer (4) to electrically connect aforesaid resistive layer (3) that contains resin and conducting fillers. It comprises, at least, one extreme protective layer (5) containing resin and dielectric layers. Note that all above mentioned layers contain one and the same resin. Proposed invention covers also method of producing aforesaid heating element (6), assembly incorporating it and method of producing the latter.
EFFECT: one type of used resin; higher adhesion and ruling out of lamination, lower costs.
22 cl 2 dwg
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Authors
Dates
2010-01-10—Published
2005-06-03—Filed