FIELD: electricity.
SUBSTANCE: invention proposes method for electrolytic increase of thickness of electroconductive pattern on dielectric substrate, including the following stages: submersion of substrate with pattern available on it into electrolytic bath, putting negative charged electrode in electric contact with pattern in electrolytic bath in process of substrate submersion and contact motion of electrode and pattern relative to each other in electrolytic bath in process of substrate submersion. Invention also proposes device for electrolytic increase of electroconductive pattern thickness on dielectric substrate. At the same time electrode in specified device is mostly installed inside cavity of screening element, to a limited extent coming out from this screening element.
EFFECT: provides for homogeneous increase of electroconductive pattern thickness on dielectric substrates with relatively high thicknesses of a layer, 10-20 micrometre.
33 cl, 9 dwg
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