METHOD OF MAKING STRUCTURED, ELECTRICAL CURRENT CONDUCTING SURFACES Russian patent published in 2010 - IPC H05K3/24 H05K3/46 

FIELD: physics.

SUBSTANCE: invention relates to a method of making structured and/or holohedral current conducting surfaces (3, 11) lying on an electrically non-conducting substrate. At the first step, a first level surface (3) is deposited on the substrate and on the second step in insulating layer (9) is deposited on places on which structured and/or holohedral current conducting surfaces (11) of the second level intersect with structured and/or holohedral current conducting surfaces (3) of the first level. There must be no electrical contact between the structured and/or holohedral current conducting surfaces of the first level (3) and the second level (11). At the third step, in accordance with the first step, structured and/or holohedral current conducting surfaces (11) of the second level are deposited and the second and third steps are repeated if necessary. Also the structured and/or holohedral current conducting surfaces have layer thickness between 0.05 and 25 mcm.

EFFECT: design of a method of making flat printed circuit board with conducting surfaces with higher density and less overall thickness and easier manufacturing.

22 cl, 4 dwg