DISPERSION FOR DEPOSITING METALLIC LAYER Russian patent published in 2010 - IPC H01B1/22 

FIELD: physics.

SUBSTANCE: invention relates to dispersion for depositing a metallic layer on an electrically insulating substrate containing an organic binding component, a metal component with different metals and/or shapes of metal particles, as well as solvent component. The invention also relates to a method of preparing the dispersion, a method making a structured metallic layer using the dispersion, if necessary, as well as to the obtained substrate surfaces and use thereof. The dispersion for depositing a metallic layer on an electrically insulating substrate contains A 0.01-30 wt % organic binding component in terms of total weight of the dispersion; B 30-89.99 wt % metal component in terms of total weight of the dispersion, where the said metal component contains at least B1 0.01-99.99 wt % first metal with a first shape of metal particles in terms of total weight of the metal component B; B2 99.99-0.01 wt % of a second metal with a second shape of metal particles in terms of total weight of the metal component; C 10-69.99 wt % solvent component in terms of total weight of the dispersion, wherein at least one of the following conditions is satisfied in the dispersion: (1) first and second metals are different; (2) the first and second shapes of particles are different.

EFFECT: preparation of a dispersion which enables to deposit a metallic layer on an electrically insulating substrate, high adhesion strength and uniformity of the metal layer may be achieved.

18 cl, 4 ex