FIELD: electric engineering. SUBSTANCE: device has additional matrices of outer terminals 10 which are electrically insulted and mounted on cap of sealed heat-removal housing. In addition device has heat-removal units 11, which are perpendicular to cap surface and are in contact with micro boards and heat-removal cap. Also device has commutation boards 12 and 13 with contact plates, insulating grill boards 16 with through current-conducting jumpers 8 and holes that are located between micro boards 5 and between micro boards 5 and commutation boards 13. Base 3 is designed as stepped multiple- layer circuit board with printed conductors on insulated layers shaped as frames of various sizes with holes and open contact plates which are located on inner and outer perimeters of frames. In addition open contact plates are made in corners of frames for connection between layers. Micro boards 5 have coaxial holes where heat removing units are mounted. Outer terminals 10 are connected to contact plates of commutation boards of cap and base 3. Through current-conducting jumpers 8 are electrically connected to contact plates of micro boards 5 and commutation boards 13. Radio elements are located in holes of insulating grill boards. EFFECT: increased density of unit design. 3 dwg
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Authors
Dates
1995-10-20—Published
1987-11-23—Filed