FIELD: electricity.
SUBSTANCE: as per the preset coordinates in a metal circular plate openings are shaped for unpacked chips. Adhesive ribbon is strained to one of outer surfaces of the metal circular plate with its sticky side inwards the plate. Unpacked chips are set as per the preset coordinates by their contacts pads onto surface of the adhesive ribbon, then they are sealed and the adhesive ribbon is removed. Polyimide photosensitive lacquer is applied and openings are formed in it. Switching is performed by vacuum metal deposition via thin strippable mask or photolithography processes are used upon vacuum-plasma metal deposition. A layer of dielectric is applied again and windows are formed in it. The last metallisation layer is applied, switching is formed with contact pads and chip components are mounted.
EFFECT: reduced labour intensity and improved reliability of microelectronic units, reduced weight and dimensions of microelectronic units.
7 dwg
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