THIN-FILM MULTI-LAYER STRUCTURE, COMPONENT INCLUDING SUCH STRUCTURE AND PROCEDURE FOR ITS SEDIMENTATION Russian patent published in 2011 - IPC C23C16/32 C23C16/517 

FIELD: metallurgy.

SUBSTANCE: corrosion resistant structure includes from 1 to 1000 groups. Also, one group includes from 2 to 100 layers (A, B) on base of carbon, silicon and hydrogen and, not necessarily, a functional surface layer (FSL). The component contains such thin-film multi-layer structure. The procedure consists in creation of primary and then secondary vacuum in a chamber. A base is etched in an active zone. A binding layer is formed by introduction of preliminary treated gas into the active zone of the chamber, by continuous base heating and by maintaining controlled temperature. Chemically active gas introduced into the active zone forms the multi-layer structure. Chemically active gas contains a single compound with a tetrahedral silicon structure or silicon-containing mixture.

EFFECT: high frictional and adhesion properties, high mechanical durability of coating and high heat resistance.

20 cl, 2 dwg, 4 tbl