FIELD: physics.
SUBSTANCE: method for thermal shielding electronic modules is implemented by removing heat using a heat-shielding compound during its thermochemical decomposition, and the device for implementing said method has a housing, the inner surface of which a cavity for placing at its centre electronic modules and a heat-insulating lining fit on the inner surface of the housing. The space between the electronic modules and the heat-insulating lining is filled with a compound of boric acid or its salt, for example, sodium tetraborate decahydrate, and an inorganic additive with decomposition temperature higher than 1100°C.
EFFECT: high specific heat-removal capacity of the compound, protection of an electronic module while improving operational characteristics, high technological effectiveness and standardisation of the assembling process.
2 cl, 1 dwg
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