FIELD: process engineering.
SUBSTANCE: invention may be used for thermal treatment of workpiece 19 or parts to produced soldered joint between solder and, at least, one part that makes a solder substrate. Heating and cooling of part 19 is performed in two sections (13, 14) of process chamber (12) incorporated in device (10) that may be separated by condensation device (15). The latter is cooled, at least, in position of availability for use. Prior to heating part (19) and for separation of chamber sections (13, 14), condensation device (15) made up of protective screen is changed from aforesaid position into position of bulkhead separating aforesaid chamber sections. In heating part (19), vacuum is produced in chamber heating section (13) and protective gas is fed into cooling section (14) and/or heating section (13). Volatile evaporations generated in treatment get settled on condensation device which prevents their condensation in the chamber cooling section.
EFFECT: continuous treatment without interruption for cleaning.
16 cl, 5 dwg
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