FIELD: processes and equipment for joining by means of hard -solder soldering members of copper or copper alloy, namely parts of heat exchanger with inner fluid.
SUBSTANCE: method comprise steps of applying soldering paste containing copper, tin, nickel and phosphorus at least on one of soldered members near contact zone of first member and second member in the form of large number of lines spaced in direction normal to direction of said contact zone; remaining material-base in contact zone exposed for reducing gas in reducing atmosphere of furnace at next heating; temporarily joining first and second members in predetermined position; heating joined members at temperature range 600 - 800°C in furnace with reducing gas atmosphere. Method provides significant removal of oxide film from surface of material-base.
EFFECT: enhanced quality of soldering due to uniform spreading of soldering material along surface in contact zone.
11 cl, 8 dwg
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