METHOD AND DEVICE FOR SOLDERING BY REFLOWED SOLDER WITH CONTROL OF VOLUME FLOW Russian patent published in 2008 - IPC H05K3/34 

Abstract RU 2329624 C2

FIELD: instrument making.

SUBSTANCE: in compliance with one aspect of the given invention, the problem of fast heating of an object being soldered is solved by reducing an initially large volume flow at constant or increasing temperature, thus preventing an overheat of minor components. Application of a volume flow of convective heater to control actual supply of heat onto the object to be soldered makes it possible to flexibly adjust the soldering process to specific requirements.

EFFECT: speed and accuracy of adjustment of varying volume flow rate.

14 cl, 6 dwg

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RU 2 329 624 C2

Authors

Bel Khans

Dates

2008-07-20Published

2004-10-29Filed