FIELD: physics.
SUBSTANCE: according to the present invention, the side surface of the material of the cutting part of an instrument is first polished and irradiated with a beam of coherent monochromatic radiation. An interference pattern is formed in the object plane of a video camera as a result of interaction of the reflected beam and the reference beam. Changes in the interference patterns are continuously video recorded. Further, cutting is performed in conditions of interest and the instrument is taken out of the cutting zone at the moment in time of interest. The temperature field of the cutting part of the instrument is determined from the change in interference patterns before cutting and after taking the cutting part of the instrument out of the cutting zone.
EFFECT: high accuracy of determining temperature value on the entire field of the cutting part of the instrument during the cutting process.
3 cl, 3 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| METHOD FOR DETERMINATION OF TEMPERATURE FIELDS IN THE CUTTING PART OF THE INSTRUMENT IN PROCESS OF CUTTING | 2010 |
|
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| METHOD OF EXPLORING DEFORMATION OF MATERIAL IN THE PROCESS OF CHIP CUTTING | 0 |
|
SU1173179A1 |
| INTERFEROMETER | 2010 |
|
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| METHOD FOR DETERMINING TEMPERATURE FIELDS IN THE CUTTING PART OF THE TOOL IN THE CUTTING PROCESS | 2021 |
|
RU2781939C1 |
