FIELD: process engineering.
SUBSTANCE: this process relates to analysis of deformation of materials at cutting. Specimen surface strained at cutting is illuminated by coherent monochromatic radiation. Deformation process is registered by digital monochromatic chamber. Reference points are constructed at the image. Two sequential frames of video record are compared. This allows getting the characteristics of displacement of two points of strained materials in the area of chip formation. Measured displacements are used to define the deformation characteristics.
EFFECT: analysis of deformation of materials at cutting in real time.
8 dwg
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