FIELD: non-ferrous metallurgy.
SUBSTANCE: invention can be used for low temperature brazing of non-ferrous metals and their alloys, for example, copper, with tin-lead solders in production of radiators, heaters, heat exchangers and other automobile equipment. Active base of the flux includes a mixture of salts of 4-amino-1, 2, 3-triazol bromine acids, 1, 2, 3-triazol bromine acids, imidazole bromine acids, 5-amino-tetrazol bromine acids, benzene azimide bromine acids, hydrazin bromine acids, semicarbazide hydrobromide. The salts of organic polynitrogen bases used have linear or cyclic structure and include 2 or more atoms nitrogen. One or several of them is a strong base ensuring flux neutrality.
EFFECT: use of active flux base ensures reduction of flux corrosion activity and increase of its fluxing activity.
2 cl, 1 tbl, 40 ex
| Title | Year | Author | Number |
|---|---|---|---|
| PRESERVING FLUX FOR LOW-TEMPERATURE WELDING | 1994 |
|
RU2056990C1 |
| FLUX FOR LOW-TEMPERATURE SOLDERING | 2004 |
|
RU2243074C1 |
| SOLDERING FLUX, METHOD OF ITS MAKING AND ARTICLES MANUFACTURED WITH USE OF THIS FLUX | 1994 |
|
RU2080228C1 |
| FLUX FOR LOW-TEMPERATURE SOLDERING OF COPPER AND ITS ALLOYS | 0 |
|
SU1123817A1 |
| FLUX FOR SOLDERING WITH QUICK SOLDERS | 0 |
|
SU1114507A1 |
| FLUX FOR LOW-TEMPERATURE SOLDERING | 0 |
|
SU863266A1 |
| FLUX FOR BRASS LOW-TEMPERATURE BRAZING | 0 |
|
SU1333515A1 |
| FLUX FOR LOW-TEMPERATURE SOLDERING | 2005 |
|
RU2285600C1 |
| FLUX FOR LOW-TEMPERATURE SOLDERING | 2010 |
|
RU2463144C2 |
| FLUX FOR LOW-TEMPERATURE SOLDERING | 2001 |
|
RU2204466C2 |
