FLUX FOR LOW-TEMPERATURE SOLDERING Russian patent published in 2003 - IPC

Abstract RU 2204466 C2

FIELD: soldering of copper and its alloys by means of tin- lead solders. SUBSTANCE: flux contains (mass%): zinc chloride, 10 - 40; ammonium chloride, 1 - 4.5; hydrochloric acid, 2 - 5; carbamide, 0.1 - 1; hydroxylamine hydrochloride, 0.05 - 1; water - the balance. Complex compounds of hydrochloric acid formed at heating provide intensive deterioration of oxide film on surfaces of part of copper and brass. EFFECT: enhanced wettability of soldered surface with solder, increased surface area of solder spreading, formation of strength joint. 2 tbl

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RU 2 204 466 C2

Authors

Nikitinskij A.M.

Gerasimov E.A.

Dates

2003-05-20—Published

2001-04-12—Filed