METHOD OF HOT FORMING PACKAGES, HOT FORMING DEVICE AND METHOD OF INCREASING PACKAGE WALL THICKNESS IN FORMING Russian patent published in 2012 - IPC B29C67/20 B29C47/06 C08J9/04 

Abstract RU 2443559 C1

FIELD: process engineering.

SUBSTANCE: invention relates to production of packages. Proposed method consists in heating foamed polystyrene sheet to plastic deformation temperature and feeding it onto made die, moving said sheet toward female die and evacuating cavity between said dies. Sheet material outer layers have close pores while layer located between said layers has open intercommunicated pores. Evacuated cavity features vacuum between male die and sheet smaller than that between female die and sheet and equals the force corresponding the beginning of plastic deformation of sheet material layer between layers with close pores. Proposed method consists in heating foamed polystyrene sheet to plastic deformation temperature and feeding it onto made die, moving said sheet toward female die and evacuating cavity between said dies. Proposed device comprises appliance to implement above described method.

EFFECT: lower weight of thick-wall package.

3 cl, 3 dwg

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RU 2 443 559 C1

Authors

Gurichev Viktor Borisovich

Panichev Jurij Vladimirovich

Dates

2012-02-27Published

2010-08-05Filed