DEVICE FOR DIE BONDING Russian patent published in 2012 - IPC H01L21/58 

FIELD: electricity.

SUBSTANCE: device for die bonding contains tool for die seizing with groove for its dimensions and opening for vacuum, heated table on which substrate is arranged, tool with vacuum chuck for seizing of solder workpiece, mechanism of gas supply and air cooling of die in soldering zone. There are openings in heated table - one opening is for substrate attachment and two openings are for supply of heated protective gas to soldering zone. Metal housing is installed and fixed on the table so that openings for supply of heated protective gas are inside close to its rear wall, housing base is heated table. In housing lid above opening for substrate attachment and in front wall there made are opening for gas output, installation of substrate and lowering of tool with seized solder workpiece or tool with seized die. Inside housing between aft wall and groove there located is gas flow spreader screw-attached via rectangular through mortise in lid. In front wall there is through mortise with width larger than groove width, height at least two times less than wall height and depth to groove, moving insert is located in mortise. Substrate occupies not more than one third of housing internal volume.

EFFECT: simplifying design and improving mounting quality due to constant protective atmosphere in zone of heating and due to improving accuracy of alignment of die and substrate.

5 cl, 3 dwg