FIELD: electronic engineering. SUBSTANCE: tool is made in the form of cylinder-hemisphere pair which provides for automatic high-precision alignment between stage surface and tool. Transparent washer with hole attached to bottom part of hemisphere enables simultaneous viewing of contact pads of chip and board on microscope monitor screen, their high-precision alignment, and reliable gripping of chip. EFFECT: enhanced wiring quality and precision of alignment of chip and board contact pads. 1 dwg
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