FIELD: process engineering.
SUBSTANCE: proposed method comprises forming laminate around soldering rod and heating laminate ends to be soldered together. Then, pressure is applied to said ends and there are heated, at least, partially. Thereafter, soldering zone is strained to increase zone surface area and to cool it. Proposed device comprises soldering rod and heater to heat laminate ends around soldering rod. Besides, it comprises means to apply pressure to said ends and method to strain for increasing soldering zone.
EFFECT: stable round shape.
12 cl, 4 dwg
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