FIELD: physics.
SUBSTANCE: method involves making holes in a substrate by moving the focal spot of focused laser radiation and plating said holes. The laser radiation is in form of a cone with a focal spot at its vertex. The focal spot is moved vertically downwards from the upper surface of the board to the lower surface of the board, under which, before piercing, a substrate of electroconductive material which reflects laser radiation is placed. Reflected laser radiation is used when piercing. The holes are then plated via electric gas discharge by applying voltage with one pole to the substrate and another pole to a ring which encircles the laser radiation and which is placed over the printed-circuit board.
EFFECT: simple and faster process of plating laser-pierced holes in a printed-circuit board.
1 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| METHOD AND DEVICE FOR LASER PIERCING | 1989 |
|
SU1718487A1 |
| METHOD AND DEVICE FOR LASER BROACHING OF HOLES IN MOVING BILLET | 1993 |
|
RU2035279C1 |
| DEVICE FOR TESTING PRINTED CIRCUIT BOARD METALLIZED OPENINGS | 0 |
|
SU1793208A1 |
| METHOD FOR PIERCING PRECISION HOLES BY MEANS OF LASER IRRADIATION | 2000 |
|
RU2192341C2 |
| UNIT FOR PRODUCING NANOSTRUCTURED LAYERS ON COMPLEX SHAPE PART SURFACE BY LASER-PLASMA TREATMENT | 2011 |
|
RU2463246C1 |
| METHOD OF GUIDING RADIATION OF MULTI-CHANNEL LASER AT PRESET POINTS OF TARGET AND SYSTEM FOR ITS IMPLEMENTATION | 2015 |
|
RU2601505C1 |
| METHOD AND APPARATUS FOR MULTI-PULSE FORMATION OF HOLES IN PRINTED CIRCUITS BY LASER BEAM | 1989 |
|
SU1591338A1 |
| METHOD AND DEVICE FOR LASER DRILLING | 1991 |
|
RU2012464C1 |
| WOVEN CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF | 2012 |
|
RU2600037C2 |
| OPTICAL-ELECTRONIC SYSTEM OF GUIDANCE AND REGISTRATION OF ADJUSTING RADIATION OF MULTICHANNEL LASER | 2020 |
|
RU2748646C1 |
