WOVEN CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF Russian patent published in 2016 - IPC H05K1/00 H05K1/14 H05K1/18 H05K3/30 

FIELD: electricity.

SUBSTANCE: invention relates to articles for installation of electronic components and interconnections of leads of said components in accordance with a circuit diagram. Said result is achieved due to that in a woven circuit board, comprising a substrate in form of a package of two or more grids with seats for installation of electronic components of any type on external surfaces of board, on surfaces of board there are contact pads or wire ends for connection to leads of electronic components. Wire ends for interconnections on one side of board are connected to leads of components or contact pads, other ends of wires for interconnections o other side of board are interconnected in nodes of networks. Disclosed is a method of manufacturing, consisting in that firmware, layout and tracing of each section of wire for interconnections are made on one outer side of circuit board to other side of circuit board through respective cell of each grid through entire grid on a "star" topology.

EFFECT: production of substrate of circuit board, providing high density, accuracy and simplicity of manufacturing.

3 cl, 1 dwg