FIELD: chemistry.
SUBSTANCE: invention relates to an adhesive compound for use in producing carbon, carbon-silicon carbide composite materials and articles therefrom. The adhesive compound contains liquid bakelite, a curing agent, dispersed carbon fibre and filler having silicon carbide. The curing agent is hydrochloric acid in form of a 10% solution in isopropyl alcohol. Along with silicon carbide, the filler used in the adhesive compound is silicon and amorphous carbon.
EFFECT: adhesive joint based on the adhesive compound has high strength and heat resistance.
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| Title | Year | Author | Number |
|---|---|---|---|
| ADHESIVE COMPOUND | 2008 |
|
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