DEVICE FOR WAVE TRANSFER THROUGH DIELECTRIC MATERIAL; MANUFACTURING METHOD OF DEVICE, AND TRANSFER METHOD OF MILLIMETRE WAVE THROUGH DIELECTRIC MATERIAL Russian patent published in 2013 - IPC G01S7/285 

FIELD: instrument making.

SUBSTANCE: proposed device for millimetre wave transfer through a dielectric includes the first signal processing circuit board for processing of signal on millimetre wave, the second signal processing circuit board that is signally connected to the first signal processing circuit board for reception of signal on millimetre wave and processing in relation to the signal on millimetre wave, and an elastic element located between the first signal processing circuit board and the second signal processing circuit board and having the specified relative dielectric permeability and the specified tangent of a dielectric loss angle. Elastic element forms a dielectric transfer path. With such a configuration, elastic element absorbs vibrations caused with external force acting on signal processing circuit boards so that vibrations of the first signal processing circuit board and the second signal processing circuit board can be decreased, and signal on millimetre wave can be transferred between signal processing circuit boards through elastic element at high speed without using any connectors and cables.

EFFECT: simpler and cheaper device.

16 cl, 12 dwg, 2 tbl