LAYOUT FOR SEALING AND THERMAL ACCOMMODATION IN LED-DEVICES Russian patent published in 2013 - IPC F21S4/00 

Abstract RU 2480669 C2

FIELD: electricity.

SUBSTANCE: light device on light diodes (LED) comprises a circuit board, a LED-device on it with a primary lens and an element of a secondary lens arranged above and at least partially resting against the primary lens. The element of the secondary lens includes a part of the lens and a flange around it, and is movable in response to adjacency of lenses due to thermal expansion of the primary lens in process of operation. Also the device comprises a cover having a hole balanced with a light path and fixing the secondary lens element above the LED-device and an elastic element of a gasket between the cover and the flange. The cover presses the elastic element of the gasket and the flange of the secondary lens element to the circuit board. The elastic element of the gasket provides for displacement of the secondary lens element caused by thermal expansion of the primary lens during operation.

EFFECT: preservation of device operation stability.

20 cl, 3 dwg

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RU 2 480 669 C2

Authors

Uilkoks Kurt S.

Val'Chak Stiv R.

Gillien Uehjn

Dates

2013-04-27Published

2008-04-30Filed