FIELD: physics.
SUBSTANCE: method of manufacturing a modular light-emitting diode (LED) crystal is proposed according to the invention, comprising the stages, at which a plurality of the LED-crystals is formed, each LED-crystal contains a plurality of the semiconductor layers and, at least, one metal electrode formed on the lower surface of each LED-crystal for the electrical contact with, at least, one of the semiconductor layers, wherein each of the LED-crystals has an upper surface and side surfaces; wherein, at least, one metal electrode has an upper surface and a lower surface opposite the upper surface; the upper surface of, at least, one metal electrode is formed on the lower LED-crystal surface, a plurality of the LED-crystals is set on the temporary supporting structure; a solid material is cast on top of the LED-crystals, which encapsulates, at least, the upper surface and the side surfaces of the LED-crystals and forms a lens over the top surface of each LED-crystal, the solid material does not cover the lower surface of, at least, one metal electrode and has a base, which runs down to the temporary supporting structure and to the lower surface of the LED-crystals, solid material curing is performed for connecting the LED-crystals together, the LED-crystals and the solid material are removed from the supporting structure, and the solid material is divided so that, at least, one metal electrode remains open for connecting to the other electrode after the lens formation.
EFFECT: cost reduction and elimination of the breaking process difficulties with the supporting plate, which leads to the formation of burrs and other problems.
6 cl, 10 dwg
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Authors
Dates
2017-04-28—Published
2013-01-15—Filed