SEMICONDUCTOR DEVICE FOR SURFACE MOUNTING Russian patent published in 2017 - IPC H01L23/367 

FIELD: electricity.

SUBSTANCE: device with one or more surface mounting instruments mounted on a carrier substrate. The semiconductor device for surface mounting contains one semiconductor element mounted on the substrate (1) of the instrument or integrated into the substrate (1) of the instrument. The substrate (1) of the instrument has a top surface and a bottom surface and has one or more electrical connection contact pads (2) of the first height and one thermal contact pad (3) of the second height located on the lower surface of the instrument substrate (1), the second height of the thermal contact pad (3) is greater than the first height of the electrical connection contact pad (s) (2), the thermal contact pad (3) is separated from the electrical contact pad (s) (2) by a groove or gap, the said carrier substrate has a metal plate (7) or a metal base layer covered with a dielectric layer (8), on which the electroconductive layer (9) is located. The said electroconductive layer (9) and the said dielectric layer (8) are not present or removed under the thermal contact pad (3) of the said instrument and under a part of the said groove or the said gap. The said terminal contact pad (3) is thermally connected by means of a thermal contact layer (5) to the metal plate (7) or the metal substrate layer, and the said electrical contact pads (2) are electrically connected by an electrical contact layer (5) to the electroconductive layer (9). The difference in height of the first height and the second height is equal to the sum of the thicknesses of the electroconductive layer (9) and the dielectric layer (8).

EFFECT: possibility of mounting simply and reliably to connect the thermal contact pad to the metal substrate of an insulated metal substrate.

11 cl, 2 dwg