METHOD FOR MANUFACTURING WAFER HOLDER TO USE IT IN ELECTROSTATIC WAFER CHUCK Russian patent published in 2013 - IPC H01L21/683 H02N13/00 

FIELD: electrical engineering.

SUBSTANCE: invention is related to the method for manufacturing of wafer holder for electrostatic wafer chuck with acceptable efficiency, free from unsatisfactory removal of semiconductor wafer which is a substrate and is to be treated from the first moment of electrostatic chuck delivery for new usage. The method of electrostatic chuck manufacturing is aimed to coat surface of the holder body having electrodes. It includes stages of sintered body receipt by raw power formation by pressing into a mould and its further sintering, formation, polishing of the sintered body surface, which will contact with substrate; it should be treated up to certain degree of roughness and smoothness; and then performance of spot blasting in order to remove only separable particles which appear in result of the above polishing.

EFFECT: wafer improvement.

2 cl, 2 dwg