FIELD: technological processes, chemistry.
SUBSTANCE: group of inventions is related to abrasive and/or chemically active particles and their application in polishing and planarisation. Abrasive composition for polishing of substrates contains multiple abrasive particles that contain distribution of polydisperse particles size, at that median size of particles by volume makes from approximately 20 nanometre to approximately 100 nanometre, value of difference, in volume, is equal or more than approximately 15 nanometre, where fraction of specified particles, larger than approximately 100 nanometres makes less than or equal to approximately 20 volume % of abrasive particles. Suspension abrasive composition is also presented for polishing of substrates, as well as method for polishing of substrates by abrasive composition.
EFFECT: high rate of polishing is achieved, as well as increased smoothness of polished surface, proper planarisation and low densities of defects.
19 cl, 4 ex, 4 tbl, 2 dwg
