FIELD: process engineering.
SUBSTANCE: invention relates to boring a hole with restrictive lateral sides. Proposed method comprises directing laser beam 4 to part surface and making a hole 2 by evaporating the part metal. Said hole is produced in several passes of laser beam 4. Every pass of laser beam 4 makes a part 2a, 2b of the hole. Laser beam 4 is directed so that it makes the angle larger than 8 degrees with lateral side 3a, 3b.
EFFECT: hole with sound lateral sides.
11 cl, 4 dwg
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