FIELD: process engineering.
SUBSTANCE: invention relates to surface processing, particularly, for preparation of plate surface and can be used in microelectronics, for example, in machining superhard material substrates for epitaxy processes. Motions of tool and solid are regular cyclic and periodical. Here, arbitrary points at the surfaces of tool and solid circumscribe transcendental curves. Relationship between the frequencies of tool and solid cyclic motions is larger than unity not equal thereto.
EFFECT: higher surface finish.
5 cl, 6 dwg
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Authors
Dates
2013-10-10—Published
2012-07-17—Filed