FIELD: process engineering.
SUBSTANCE: invention relates to machining of diamonds with application of diamond abrasive powder. Proposed process comprises processing the diamond by the tool with diamond abrasive powder grains. Note here that tool effects are brought on diamond along with generation of elastic coherent waves from the area of contact between tool and diamond. Note here that speed and acceleration of abrasive powder grains represent periodic time functions. Note also that modes of mutual displacement of said tool and said diamond are selected to make local stress in diamond surface ply caused by powder grains motion not exceeding ~1.0·1012 Pa.
EFFECT: high quality mechanical processing in whatever crystallographic orientation.
11 cl, 13 dwg
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