FIELD: heating.
SUBSTANCE: heat removal device consists of a housing with a heat sink, elastic elements, which are arranged in it and installed between the heat sink and a heat-stressed electronic module, a heat-conducting structure located between the heat sink and the heat-stressed electronic module; the heat sink has finning and inclined surfaces and is installed by means of fastening assemblies in the housing wall; on outer and inner surfaces of the heat sink there are heat-conducting gaskets, and elastic elements are located between the heat sink and the housing.
EFFECT: improvement of the device.
5 cl, 6 dwg
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