HEAT-REMOVING MULTILAYER PRINTED CIRCUIT BOARD Russian patent published in 2025 - IPC H05K1/02

Abstract RU 2833247 C1

FIELD: electronic equipment.

SUBSTANCE: invention is intended for heat removal from electronic components of printed circuit boards of heat-loaded on-board instruments. In a heat-removing multilayer printed circuit board containing foil dielectrics, with copper electroconductive layers, and insulating gaskets, heat sink from thermal pads, connected by metallized electrically insulated through holes on the mounting layer and on the inner layers and formed from copper, which is part of conducting layers, which are electrically insulated, additional heat sink is introduced, formed by internal electrically insulated heat-conducting copper layers and metallization on ends of multilayer printed circuit board, with galvanic and thermal coupling with plated electrically insulated through holes, combined into a group, note here that metallization at multilayer printed-circuit board ends is U-shaped along multilayer printed-circuit board perimeter.

EFFECT: increased efficiency of heat removal from all heat-generating electric radio elements to the printed circuit board and from the printed circuit board to the structural elements.

1 cl, 4 dwg

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RU 2 833 247 C1

Authors

Avramenko Vladimir Vitalevich

Biryukov Sergej Georgievich

Minina Larisa Nikolaevna

Dates

2025-01-15—Published

2024-01-23—Filed