ELECTRONIC MODULE Russian patent published in 2016 - IPC H01L23/34 H05K7/00 

FIELD: computer engineering.

SUBSTANCE: invention relates to computer engineering and can be applied to radio-electronic equipment (REE) with set of replaceable modules, operating in conditions of higher heat release, significant mechanical loads, as well as aggressive weather factors in field army operation. Proposed electronic module design includes at least one channel to direct flow of cooling heat medium into electronic module, and insulating REE elements from direct contact with said heat medium. Walls of channel housing does not allow coolant flow to dissipate in inter-unit space, wherein coolant is concentrated on heat-loaded sections. Channel housing is made from heat-conducting material and its outer surface contacts with heat-loaded elements of module. Efficiency of heat removal via channel from heat-loaded elements can be amplified by application of heat-conducting gaskets, or thermo-paste.

EFFECT: technical result is increased efficiency of removing heat released by REE elements, while saving of heat medium.

1 cl, 11 dwg