FIELD: process engineering.
SUBSTANCE: invention relates to abrasive processing and can be used for wafer slicing of mono- and polycrystalline materials. Abrasive article comprises elongated body, binder ply on its surface and abrasive grains contained on said binder ply with mean concentration of abrasive grains of approx. 0.02 car/m and 0.30 car/m. Invention covers the method of sapphire cutting with the help of aforesaid abrasive article.
EFFECT: higher wear resistance and longer life.
15 cl, 8 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| ABRASIVE ARTICLE | 2010 |
|
RU2569254C2 |
| ABRASIVE ARTICLE (VERSIONS) AND METHOD OF ITS FORMING | 2010 |
|
RU2508968C2 |
| ABRASIVE ARTICLE | 2011 |
|
RU2570256C2 |
| ABRASIVE ARTICLE AND METHOD OF ITS PRODUCTION | 2012 |
|
RU2574538C2 |
| ABRASIVE ARTICLE (VERSIONS) AND METHOD OF ITS FORMING | 2010 |
|
RU2520288C2 |
| RIGID OR FLEXIBLE MACRO POROUS ABRASIVE ARTICLE | 2009 |
|
RU2486047C2 |
| ABRASIVE TOOL (VERSIONS) | 2010 |
|
RU2507056C2 |
| ABRASIVE TOOL (VERSIONS) | 2010 |
|
RU2501645C2 |
| CUTTING WHEEL | 2010 |
|
RU2498892C2 |
| ABRASIVE ARTICLE (VERSIONS) | 2012 |
|
RU2556250C2 |
