FIELD: chemistry.
SUBSTANCE: invention relates to compounds based on thermoreactive resins and can be used for soaking and sealing of condensers, windings of transistors, transformers in different branches of industry. An epoxy compound includes, wt. p.: an epoxy diane resin ED-20 - 100, a polyamide hardener PH-300 - 40, a modifier trichloroethylphosphate - 30, a structuring additive - potassium polytitanate K2O·nTiO2 at n=4, 5, 6 - 0.1-0.5.
EFFECT: invention makes it possible to obtain epoxy compositions with high parameters of fire resistance and elasticity.
1 tbl, 9 ex
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RU2280053C1 |
Authors
Dates
2014-06-27—Published
2012-10-10—Filed