MODIFIED EPOXY COMPOUND Russian patent published in 2016 - IPC C08L63/02 C08K3/10 C09C3/12 C09K3/10 

FIELD: chemistry.

SUBSTANCE: invention can be applied for hermetic sealing of products of electronic equipment, for soaking and filling of units in aircraft-, ship- and automobile building, including in the creation of polymer composites for construction purpose, for example, as binding agents in the production of carbon fibre reinforced plastics, applied for the production of airplane fuselages, helicopters blades, engine cases, sport equipment, etc. A modified epoxy compound includes epoxy diane resin ED-20, a polyamide hardener PH-300, a modifier trichloroethylphosphate, a structuring additive on the base of potassium polytitanate K₂O·nTiO₂, n=4, 5, 6. The powder of potassium polytitanate is dressed with a 1-3% water solution of aminopropyltriethoxysilane with pH=5 with the following content of the compound components, in wt. p.: epoxy diane resin ED-20 (100), polyamide hardener PH-300 (40), modifier-trichlorethylphosphate (30), structuring additive (0.1-0.5).

EFFECT: increase of elasticity, reduction of combustibility, preservation of exploitation properties.

1 tbl, 12 ex