FIELD: blasting operations.
SUBSTANCE: microelectromechanical isochoric fuse comprises microelectromechanical structure comprising a silicon crystal with an area of the porous layer, in which pores hydrogen and oxidant are doped. The microelectromechanical structure is made of silicon crystals of the same size, located sequentially and coaxially starting from the upper silicon crystal, with the area of the porous layer with the thickness of up to 50 mcm, in which pores hydrogen and solid oxidant are located of the heat conductive element - monocrystalline silicon crystal, and the silicon crystal with the area of the porous layer with the thickness of not less than 60 mcm, mounted on the glass pedestal with a hole in the central part. The structure is fixed on the frame integrated in the housing in which vacuum is created, at that in the upper housing cover the holes with different diameters are made, in which the plugs are inserted.
EFFECT: invention enables to change the ratio of weight and size of fuse and explosive item, ensures burst delay.
1 dwg
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Authors
Dates
2014-07-10—Published
2012-12-29—Filed